Asus RMA (Return Merchandize Authorization) Lab was found in April, 2002 in Çizgi Electronics Technical Service Department.
Until that date, Asus products were being tested, when a defectiveness was determined, the product was being changed or sent back to Asus in time periods. That was both lost of time and the money of Turkey.
Since April 2002, with the negotiations and the investments with Asus, Çizgi Electronics became permitted in L2 applications (changing big, important or SMD parts, fixing broken traces, classifying defectiveness and creating a database about defectiveness etc.) which is only permitted for some of big distributors beside L1 applications (inspection and defectiveness determination).
We can separate RMA Lab founded in the purposes below:
- L0: Pre-screen
- L1: Module Swap
- L2: Module Swap+Change Board Connectors (Exa: USB connectors or Button or Power Jack)
- L3: Board Level Repair (Not include BGA chipset repair)
- L4: Board Level Repair (Include BGA chipset repair)
L1 Pre-Test Service
In the first step, the product which is brought to RMA service in a static bag, is inspected visually, looked for if there's a big damage, or a missing part and if the label is on it's place.
After, the barcode of the product is scanned and the product is checked to be a recorded in Çizgi Electronics database. The serial number of the product, the enterprise that sent the product and the complaint are entered information in that level. Çizgi Electronics recorded of the imported products since 1992 in Microsoft SQL Database.
Çizgi Electronics' all registration data is realized by an application called RMA.Net which is in tune with LOGO Gold accounting system and which is developed by Çizgi Electronics itself. RMA.Net developed in VB.Net 1.1 ambient, is multi-user friendly and capable of simultaneously service tracking.
Two copies are printed named "Repair&Maintenance tracking form" and "Repair&Maintenance Tracking Form of customer" from the application and the second is given to the customer. The customer is informed about the progress of his/her product by the e-mail registered in the system.
At the same time, the phase of the progress of the product and the application on the product can be checked on distributor web site. For example Çizgi Electronics web site: www.cizgi.com.tr
After, the product with a defectiveness is passed again the visual inspection and pre-test levels. In that phase Asus pre-test standards are applied, the switch and jumper settings are checked.
If the product with a is a motherboard, before we put the processor and the other components, all the currents on the board are checked. So, a possible damage on the components is blocked.
To get easier in the progress, CPU emulators prepared by Asus are used. The ends of all the currents on the motherboard and the other signs are marked on the cards which are prepared according to different CPU structures.
Then, we pass to a level named "Space Montage". Here the product which will be tested is set up out of a PC chassis, on an antistatic insulating sponge with all of the connections. If there's a specification about the defectiveness, some of the phases can be skipped. For example, if the user's complaint is "USB port doesn't work" the Post card testing phase can be skipped.
In "Space Montage" level, a small circuit is used to make turn on/off easier. Besides, the "Protect Boards" are used to protect RAMs, CPUs, VGA cards and the other components, that service uses.
In "Space Montage" level Post Code Readers are used. Those cards give the hexadecimal code of the error if it appears in the boot phase.
If the product with a defectiveness is a motherboard, in the "Space Montage" level, the terminators simulating what you can connect to all Parallel, Serial, USB and Mouse, Sound and Game Ports are connected. L1 ends with the determination or localization of the problem and with a sticker put on the board the product is given to L2 service. L1 Pre-Test service uses different measuring instruments.
L2 SMD Rework & Repairing
If the problem couldn't be determined in L1, at last, a software brought by Asus for each motherboard model is run with the terminators we've described above and we determine the defectiveness.
On the way from L1 to L2, the circuit schematics and test apparatus sent by Asus for each component on the motherboard helps very much.
Çizgi Electronic's engineers got experience in time and they can find fast solutions which L1 reaction leads to which L2 fixing. But especially the determination of the cracks and breakages on the multi-layer PCB is made difficultly.
In some defectiveness evidence , all the signals described on the test apparatus have to be watched one by one by using a high frequency numeric Oscilloscope.
The oscilloscope called Tektronix 2022 which is being used in this purpose is a digital machine with memory that can do spectrum analyzer, measure current and frequency and it has 200MHz large bandwidth.
At this level, on the more developed Post Code Readers, while the progress continues step by step, the values on the data way and address can be read. After that level, the defectiveness evidence is determined exactly and we pass to SMD Rework level.
One of the most important L2 equipment is AM6000 model fixing station manufactured by JCB. (Rework Station).
In that machine there are tools for ripping the solder, an air pump which serves to rip the components, hand tools with absorbent ends to do the job without using hands, templates that protect other components and creates an absorbent power.
There are videos of some of those applications on here.
Besides, we send DVDs which contain the information used in our labs to anyone who wants.
The components like the condensers which have the through-the-hole technology or PCI and RAM slots, all of the components are ripped with solder absorbers at L2 level.
Soldering irons with special ends are connected to JBC AD 4300 Dual Soldering Station. Between those soldering irons, there are irons with sharp and aslope ends and also irons named "tweezers" which can easily handle the solder.The new components from the warehouse are put into the older parts' places.
At that level if you put the liquid named "Flux" on the area that will be soldered; the solder can just handle metal parts.So it's possible to solder just passing directly with a soldering iron without losing time by soldering the thin pins one by one.
SMD the most part of SMD components can be soldered to their place with hot air soldering thanks to liquid soldering techniques.
The change of the chipsets in BGA (Ball Grid Array) forms is made with machines named BGA Rework. Those chipsets are produced with SMD technology and they can be soldered just on the soldering points arranged in carrelage form on the motherboard, so a special soldering machine is needed.
One of the new standards; RoHS leaded-free components can be easily changed with DEN-ON RD 500 Rework Machine.
In BGA type chipsets, under a few cm area, there are hundreds of connections. In that situation like it's impossible to align the chipsets visually and put to the soldering point, Denon RD500 has a optical mechanism to do that job. That mechanism gets out from where it hides, helps to align the chipset or the slot, if needed.
First a simulation is made with an exemplar chipset, the values are get by sensors, the templates are created for the temperatures and the duration of real application.
The calibration of optical devices with laser readers is realized by Optical Power Multi Tester.
It can solve the problem caused by the power loss of the contacts with the calibration of the contact power.
The low values of voltage in the voltage canals can be determined by PSU (Power Supply Unit) Test Machine. The real voltage values of the +12V, +5V, +3.3V, -12V canals which lead to the mainboard can be decreased or increased and the voltage changes can be tracked. An oscilloscope can be connected to the system to watch the undulation caused by DC levels of the current coming from the PSU canals.
With the new PSU test machine of Çizgi Electronics, FA-4200, the features like shortcut protection or overload can be tested. With the software came with the machine, the current values on the PSU are passed by loading tests like %25, %50, and % 100. In the report created after tests all of the results of tests can be seen.
Antistatic PCB containers, PCB rack slots, working benches, solder pools, all sizes of boxes to store SMD components and shelves are present in Çizgi Electronics Asus RMA Lab.
A component list of all products is a condition for a piece reserve policy to fix the defectivenesss at L2 level.
Çizgi Electronics won the high technology know-how produced with SMD technology and adapted it to the country's needs, so decreased the dependence to abroad. Çizgi Electronics leaded to creating standards about the tests, fixing of computer components and the electronic card repair engineering. It assimilated the latest technology in its working sector, made the necessary technology transfers, so it has the mission of re-achieving of the destructed products to our country.
This mission is carried out with Asus Inc. The exact determination of the breakdown can be made by the CPU emulators that can test all kinds of motherboards, Post Card which show the breakdown step by step, AGP, PCI and CPU Tester and high frequency digital oscilloscopes in Çizgi Electronics RMA (Returned Merchandiser Authorization) labs. Over 4000 types of spare parts are stocked in ESD electrostatic protection ambient. Labs have the machines that can perfectly rip, put and solder the multi-surface montage electronic material which has a very sensitive pin formation like BGA (Ball Grid Array), CSP (Chip Scale Package), QFP (Quad Fiat Pack) to montage or rip the integrated circuit parts.
Today with the information, the experience, the technical possibilities and the educated personnel, our RMA lab whose formation is real and organized can give advices to many other enterprises to create their own RMA labs. We believe that we can get higher with the importance that we give to the customer satisfaction and with investments for our services.
View's from RMA LAB